powerZONE Products for the week of September 30, 2002


AMI Semiconductor Says . . .
I3T80: 80-V 0.35-µm'Smart Power' SoC Solution
Automotive, medical, industrial and peripheral applications benefit from reduced component count and cost

AMI Semiconductor (AMIS) announces the availability of I3T80 - the first in a series of I3T mixed-signal technologies that allows system designers to reduce component count, save space and lower costs by integrating complex digital circuitry, embedded microprocessors and high-voltage functionality into a single IC. Suitable for automotive, medical, industrial, peripherals and other high-voltage designs, the AMIS I3T80 ASIC technology enables the delivery of the industry's first 0.35µ CMOS "Smart Power" system-on-chip (SoC) solutions for voltages up to 80V.

"I3T80 is the first high-voltage technology that integrates powerful 80V capabilities within a dense mixed-signal 0.35µ CMOS technology," said Marnix Tack, worldwide technology director at AMIS. "It allows our customers to develop complex high-voltage Smart Power SoC solutions for applications in areas such as the proposed 42-V PowerNet specification."
The AMIS I3T technology roadmap plans for the launch of I3T technologies for other voltage levels and a 50V version of the technology should be available by the end of 2003.

The I3T80 technology comes with a full library of high-voltage DMOS and bipolar devices including high performance floating vertical nDMOS transistors with very low on resistances (RDS (ON)) down to 150mO.mm2 and breakdown voltages higher than 80V. ESD performance of well above 4kV HBM has been proven. The technology is built upon the existing AMIS LV mixed-signal 0.35µ CMOS process with features such as high-density Metal-Metal capacitors and well-matched high ohmic resistors. A rich digital library offers a gate density of 15,000/mm2 and a wide portfolio of IP is available.

I3T80 can deliver Smart Power SoC devices with total gate counts in excess of 150k. These SoC devices can incorporate high-voltage circuitry such as motor controller drivers and DC-DC converters and high-precision analog circuits including bandgap filters, ADCs and DACs. Available IP blocks cover PLLs, USB interfaces, bus protocol controllers and controllers for CAN and LIN connectivity, while ROM and RAM memory solutions can all be supplied. A low-cost embedded One Time Programmable (OTP) memory is currently available and a high-density flash memory will be released in early 2002. Embedded microprocessor options include ARM7TDMI and 8051 cores.

analogZONE Says . . .

This is world-breaking winning technology and the numbers in this press release suggest that it could be a major player in the automotive industry with future 42-V systems with CAN products; it will certainly be well noticed in the 48-V telecom industry although new products there are stalled for the next while.

While I believe this is a winning process I have received no reply from the company when looking for a data sheet to make any further comment. Nor do we have a price for this first product. The press release will have to speak for itself.



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